Shenzhen Bells Electronics Co., Ltd.

home products Rework/Reballing tool bga stencils, stencil,BGA chip ball arrangement template NH82801HBM etc, keller

bga stencils, stencil,BGA chip ball arrangement template NH82801HBM etc, keller

Detailed Product Description


BGA chip ball arrangement template NH82801HBM

Ball 0.6

condition : NEW 

Spec: 79.6*79.6mm or 99*99mm

 

We provide all kind of bga tempaltes....

  • 0.76*0.76mm universal template
  • 0.6mm universal template
  • 0.5mm universal template
  • 82801GB/82801GBM
  • 82801HB/82801HBM
  • 82801FB/82801FBM
  • 82801EB/82801EBM
  • 82801DB/82801DBM
  • 845MP/855PM
  • 915PM/915GM
  • 945 northbridge
  • 945GM/945PM
  • 965 northbridge
  • FGO5200
  • ATI9200/ATI9600
  • ATI7500/ATI9000
Spec: 79MM*79MM, length between holes:68MM

 

Contact us for photo and more information.

 

 

bga stencils, stencil,BGA chip ball arrangement template NH82801HBM etc, keller bga stencils, stencil,BGA chip ball arrangement template NH82801HBM etc, keller

Send your message to this supplier
« Prev Product ... 36 37 38 39 40 41 42 ... Next Product »

Other Products from this Supplier

Company Info

Shenzhen Bells Electronics Co., Ltd.
[China (Mainland)]
[Verified Member]

City: Shenzhen
Province/State: Guangdong
Country/Region : China (Mainland)

Business Type:Manufacturer, Distributor/Wholesaler

View Contact Details

Email this page Bookmark this page Print this Page